Downloads:
Unit: India Security Press - Nashik
Tender Number: Invitation Letter
Tender Ttile: Invitation for Industrial Conclave / Consultation to prepare future road map for Next-generation of Indian e-Passport Chip-Inlays as per ICAO guidelines 9303 Part-13
Publishing Date:
Closing Date: 01/15/2026 11:59pm
Tender Type:
